About the Proceedings
Since its establishment in 2018, the HI-AM Conference has served as a key academic event in Canada, dedicated exclusively to sharing advancements in research and development in the field of additive manufacturing (AM). This conference provides a valuable platform for researchers, industry professionals, and academics to engage with the latest innovations and trends in the field.
Between 2018 and 2024, the conference featured research abstracts exclusively in its conference booklets. Past programs and abstracts are accessible from the conference website. Beginning with the 2025 edition, the conference will introduce proceedings, including peer-reviewed short manuscripts of accepted presentations.
The HI-AM Conference is a key component of the HI-AM 2.0 Project, a research initiative funded by the Natural Sciences and Engineering Research Council of Canada (NSERC), focused on advancing the industrial adoption of metal AM through research and development. The conference serves as a platform for sharing research findings from HI-AM 2.0 groups and external experts contributing to the field.
Focus and Scope
The conference is focused on additive manufacturing (AM) and covers a broad range of topics from various engineering and scientific disciplines, including mechanical engineering, materials science and engineering, chemical engineering, data science, and machine learning. Areas of focus include, but are not limited to, the following:
- Additive manufacturing technologies: powder bed fusion (laser, electron beam), directed energy deposition (laser, electron beam, arc-based), cold spray and solid-state AM, binder jetting, material jetting, material extrusion, vat photopolymerization, hybrid processes
- Materials for additive manufacturing and material-specific process development: metals, polymers, ceramics, composites, biomaterials, functional and advanced materials, multi-material systems
- Design for additive manufacturing (DfAM)
- Material, process, and component modeling
- Metrology, control, and quality assurance
- Characterization and post-processing
- Additive manufacturing applications: aerospace, automotive, medical and biomedical, energy and natural resources, consumer products
Peer-review Process
The publication process begins with the submission of a short abstract, which is evaluated by the conference review committee. Upon acceptance, the abstract will be assigned either an oral or poster presentation format. Authors with accepted abstracts, regardless of the presentation format, are eligible to submit a short manuscript for inclusion in the conference proceedings.
All submissions to the HI-AM Conference Proceedings undergo a rigorous peer-review process to ensure the quality and integrity of the research presented. Each manuscript is evaluated by expert reviewers based on its originality, technical content, and contribution to the field.
For details of the review process, please visit the conference website and select the relevant event year.
If you have any questions regarding the peer review process, please contact us at hiam@uwaterloo.ca.
Submission Guidelines and Formatting
Authors can submit their manuscripts for consideration in the proceedings directly through the HI-AM Conference website. Once on the site, please select the relevant event year and look for the conference submission tool and formatting guidelines.
Author Agreement and Fees
By submitting your research to the HI-AM Conference Proceedings, you acknowledge and agree to the terms of the conference author agreement. To be considered for publication in the HI-AM Proceedings, at least one presenting author must register for the conference and present their work during the event. Manuscripts will not be published if the work has not been presented. For more information, please visit the conference website and select the relevant event year.
Open-access Policy
The proceedings are licensed under the Creative Commons Attribution-NonCommercial (CC BY-NC) license.
